ʻO Electroplating Grade Copper Sulphate

Hōʻike Pōkole:

Hoʻohana ʻia ke keleawe sulfate i ka ʻoihana electroplating no ka plate keleawe keleawe a

ākea-wela ākea piha huali keleawe plating ion nā mea hoʻohui e pale aku i ka hao hao hoʻoheheʻe,

hoʻomaikaʻi i ke kūpale o ka ʻaihue, ka uila uila, ka noʻonoʻo, ka pale ʻaʻa a me

hoʻonui i nā mea hoʻonani.


ʻIke kikoʻī

Nā huahana huahana

Nā hōʻailona ʻenehana

'Ikamu

Papa Kuhikuhi

CuSO4 · 5H2O w /% 

98.0

E like me w /% ≤

0.0005

Pb w /% ≤

0.001

Ca w /% ≤

0.0005

Fe w /%

0.002

Co w /% ≤

0.0005

Ni w% ≤

0.0005

Zn w% ≤

0.001

ʻO Cl w% ≤

0.002

Wai insoluble mea% 

0.005

waiwai pH (5%, 20 ℃)

3.5 ~ 4.5

Hōʻike Huahana

Wahi a nā kūlana hana a me nā koi ʻokoʻa, ʻo ka ʻike i loko o ka sulfate keleawe 200 ~ 250g / L, 210 ~ 230g / L, a i ʻole 180 ~ 220g / L. Inā haʻahaʻa ka keleawe sulfate keleawe, haʻahaʻa ka haʻahaʻa o ka hana i ʻae ʻia a haʻahaʻa hoʻi ka maikaʻi o ka cathode o kēia manawa.

Hoʻohālikelike ʻia ka hoʻonui ʻia ʻana o ka ʻike keleawe sulfate e kona hoʻoheheʻe ʻia, a me ka hoʻonui ʻia o ka ʻikepili sulfuric acid i ka electroplating, hoʻoliʻiliʻi ka solubility o ke keleawe sulfate. No laila, pono ka haʻahaʻa o ka sulfate keleawe ma mua o kona solubility e pale ai i kona heleleʻi ʻana.

ʻO ke ʻano o ka hoʻonohonoho ʻana i ka hopena plating keleawe

E hoʻonā mua i ka nui o ke keleawe sulfate i 2/3 o ka nui o ka wai i hoʻomohala ʻia, ke pau a hoʻoheheʻe ʻia ke keleawe sulfate, e hoʻohui mālie i ka waikawa sulfuric ma lalo o ka hoʻonāukiuki mau ʻana. a me ka kānana, Ma hope o ka hoʻohui ʻana i nā mea hoʻohui i kuhikuhi ʻia, kūpono ka plating hoʻokolokolo a hiki ke hoʻokomo ʻia i ka hana.

Hōʻike Hoʻohana Huahana

ʻO ka noi ʻana o ka sulfate keleawe ma ke ʻano he hopena i ka electroplating hiki ke pale pono i ka hanana o nā pinholes, ke one, ʻeleʻele, punahelu a me nā hewa ʻē aʻe i ka plating keleawe, a hōʻoia i ka likelika o ka mahele o ka mahele o ka pā i ka wā electroplating a me ka hiki i ka hohonu hohonu no ka hohonu nā puka a me nā puka liʻiliʻi, A kōkua i ka hoʻomaikaʻi ʻana i ka uila uila, ka hoʻoliʻiliʻi a me ka ikaika o ka uhi.

Nā pono o ke keleawe sulfate electroplating

(1) Hāʻawi ke keleawe keleawe keleawe i ka gloss mai nā wahi kiʻekiʻena o kēia manawa i kahi kahe kahe mau o kēia manawa.

(2) He ductility waiwai ka keleawe keleawe keleawe a me ka hopena pae maikaʻi loa, i hoʻohana nui ʻia e like me ke kumu o ka uhi hoʻonaninani.

(3) ʻO ka pono o ka electroplating keleawe sulfate kokoke i 100%, a hiki ke electroplated me ke kiʻekiʻe o kēia manawa

(4) Maʻalahi ka mālama ʻana i ka ʻauʻau electroplating a me ka hoʻomaʻemaʻe wai.

(5) Liʻiliʻi ke koʻikoʻi o loko o ka uhi keleawe sulfate keleawe a palupalu ka uhi.

(5) ʻOi aku ka maikaʻi o ka conductivity o ke keleawe keleawe sulfate.

Pūʻolo Huahana

托盘
电镀用硫酸铜包装

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