Electroplating Grade Copper Sulfate
Nā hōʻailona ʻenehana
| 'ikamu | Papa kuhikuhi |
| CuSO4·5H2Ow/% ≥ | 98.0 |
| As w/% ≤ | 0.0005 |
| Pb w/% ≤ | 0.001 |
| Ca w/% ≤ | 0.0005 |
| Fe w/%≤ | 0.002 |
| Co w/% ≤ | 0.0005 |
| Ni w% ≤ | 0.0005 |
| ʻO Zn w% ≤ | 0.001 |
| Cl w% ≤ | 0.002 |
| ʻO nā mea hiki ʻole i ka wai % ≤ | 0.005 |
| pH waiwai (5%, 20 ℃) | 3.5-4.5 |
Hōʻike huahana
Wahi a nā kūlana hana a me nā koi like ʻole, ʻo ka kikoʻī kikoʻī o ke keleawe sulfate he 200 ~ 250g / L, 210 ~ 230g / L, a i ʻole 180 ~ 220g / L.Inā haʻahaʻa ka maʻiʻo keleawe sulfate, haʻahaʻa ka haʻahaʻa hana i ʻae ʻia a haʻahaʻa ka hana cathode i kēia manawa.
ʻO ka hoʻonui ʻia ʻana o ka maʻiʻo keleawe sulfate i kaupalena ʻia e kona solubility, a me ka hoʻonui ʻana o ka ʻona sulfuric acid i ka electroplating, e emi iho ana ka solubility o ka keleawe sulfate.No laila, ʻoi aku ka haʻahaʻa o ke keleawe sulfate ma mua o kona solubility e pale ai i ka ua.
ʻO ke ʻano hoʻonohonoho hoʻonohonoho hoʻoheheʻe keleawe
E hoʻoheheʻe mua i ka nui o ka copper sulfate i 2/3 o ka nui o ka wai mehana i hoʻonohonoho ʻia, i ka wā e hoʻoheheʻe ʻia ai ke keleawe sulfate a maloʻo, e hoʻohui mālie i ka waikawa sulfuric ma lalo o ka hoʻoulu ʻana mau (ʻo ka hoʻohui ʻana i ka sulfuric acid he hopena exothermic), static plating solution. a kānana , Ma hope o ka hoʻohui ʻana i nā mea hoʻohui i kuhikuhi ʻia, ua kūpono ka plating hoʻokolokolo a hiki ke hoʻokomo ʻia i ka hana.
Hōʻike Hoʻohana Huahana
ʻO ka hoʻohana ʻana i ke keleawe sulfate ma ke ʻano he hopena i ka electroplating hiki ke pale pono i ka hiki ʻana mai o nā pinholes, one, ʻeleʻele, ʻeleʻele a me nā hewa ʻē aʻe i ka pā keleawe, a e hōʻoia i ka like ʻole o ka māhele mānoanoa o ka pā i ka wā electroplating a me ka hohonu plating hiki no ka hohonu. nā puka a me nā puka liʻiliʻi , A kōkua i ka hoʻomaikaʻi ʻana i ka conductivity uila, ductility a me ka ikaika tensile o ka uhi.
ʻO nā pono o ka copper sulfate electroplating
(1) Hāʻawi ke keleawe sulfate plating i ka nani mai ka wahi kiʻekiʻe o kēia manawa a hiki i kahi kahe kahe mau o kēia manawa.
(2) Copper sulfate coating he waiwai ductility a me ka maikaʻi leveling hopena, i hoʻohana nui ʻia e like me ke kumu o ka uhi ʻana.
(3) ʻO ka maikaʻi o kēia manawa o ke keleawe sulfate electroplating kokoke i 100%, a hiki ke hoʻopili ʻia me ke kiʻekiʻe o kēia manawa.
(4) He maʻalahi ka mālama ʻana i ka ʻauʻau electroplating a me ka mālama wai.
(5) He liʻiliʻi ke koʻikoʻi o loko o ke keleawe sulfate a palupalu ka uhi.
(5) He maikaʻi ka conductivity o ke keleawe sulfate plating.
Hoʻopili Huahana
1. Hoʻopili ʻia i loko o nā ʻeke i ulana ʻia i ka ʻeke o 25kg/50kg ʻupena i kēlā me kēia, 25MT no 20FCL.
2. Hoʻopaʻa ʻia i loko o nā ʻeke jumbo i ulana ʻia me ka ʻupena 1250kg i kēlā me kēia, 25MT no 20FCL.
Kiʻi kahe
FAQ
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